RFID tag production and packaging process 2020-05-08
Although the production chain of RFID tags is not long, it requires a lot of equipment. From the point of view of manufacturing process, it is divided into chip manufacturing, antenna manufacturing, chip flip, synthetic material printing, lamination or film synthesis.

1. Label production process

1. Antenna synthesis antenna can use traditional corrosion antenna or printed antenna.

Comparatively speaking, the manufacturing cost of the two antennas is basically the same. For now, due to the high price of conductive ink and the strength of the printed antenna itself, corroded antennas are still the main products in the market. Antenna corrosion Because of environmental pollution factors, many companies are committed to the development of printed antennas. In fact, printing is also polluted, especially the air directly hurts the operator. The latest type of conductive silver paste has passed the trial printing of flat round and flat screen printers, and will be available in the near future. The price is much lower than the existing silver paste.

The corrosion antenna can be aluminum foil or copper foil. Manufacturers need a set of specially designed printing equipment and a set of corrosion equipment.

The printing of line anti-corrosion ink can use rotary type (circular pressure round) screen printing machine or special design gravure printing machine. The special electronic gravure printing machine launched by Zhenjiang Machinery Co., Ltd. is first-class. However, the printing of conductive silver paste has higher requirements on the screen printing machine. The major foreign companies use flat screen flattening or flat rounding. This type of screen printing machine does not really pass a lot. From the perspective of printing speed, color accuracy and drying tower performance, the screen printing lines of KINZEL iebdruckmaschine GmbH and KLEMM GmbH in Germany are first-class, but KLEMM has closed down.

The production of aluminum foil antenna corrosion has particularly high requirements on the accuracy of the transmission device. The roll-to-roll aluminum foil etching machine of Zhenjiang Machinery Co., Ltd. is completed at a time from etching, cleaning, drying and winding. Represents world-class level.

2. Chip flip chip production belongs to the high-tech field. Only a few have been able to do so far, mainly including TI, Siemens Infineon, Philip and other manufacturing heads. The most domestic leader is Shanghai Fudan Microelectronics. So far no domestic factory has chip embedding capability. However, several companies are already preparing chip-embedding equipment, such as the United States and Germany ’s Newport. Two domestic companies are also stepping up assembly, and it is estimated that they will come out soon.

3. Synthetic material printing is usually completed by ordinary sheet-fed printing presses, such as Heidelberg, Roland and KBA. Since most synthetic materials are thicker than ordinary paper, KBA's printing presses are more suitable for printing. No matter what kind of printing machine is used, roll-to-roll production, 500mm printing format is the basic requirement, otherwise it will reduce the degree of automation of the entire production line.

4. Laminating film equipment The equipment with the strongest integration ability and the strongest processing ability is the RFID synthesis production line of German Biromi and KINZEL GmbH. Can complete inlay pre-inspection, synthesis, in-line die cutting, re-inspection, waste cutting and re-connecting and other tasks.

   The synthesis processes of the two companies are somewhat different. The Emperor Biloma synthesized the Inly sheet with the chip attached to the printed surface material. The working width of the equipment is about 10 cm, which is suitable for small batch production. KINZEL's laminated film line is based on the same working width (500mm) of screen printing and flip chip equipment, and the whole Inly is die-cut and laminated at one time, or laminated and die-cut. This process reduces the damage caused by unwinding and rewinding of the bare open wire during the slitting process, which is especially important for the sensitive silver paste printed antennas, and the production speed is much higher. When the product comes off the production line, the whole process of RFID tag is over.
  
Second, the label packaging process

1. Involving IC packaging technology, the more special ones are: long bumps (long gold balls) and flip-chip process. After the tape is finished from the wafer, it will probably go through long bumps (pure gold) and reduce Four processes of thinning, dicing, and reverse bonding complete the chip packaging process.

2. Involving printing technology, including antenna printing (generally not available in card factories, card factory antennas are generally wrapped around enameled wire), synthetic material printing (label surface printing), laminating film (including printing stickers, cutting, etc. The printed stickers are not available in the card factory). Generally, after the antenna printing and synthetic material printing are completed, the chip is packaged, and finally the lamination film is laminated.

3. These processes are in common with the card manufacturing process, especially related to printing technology. Many devices have similar functions. Therefore, there should be no technical difficulties in switching from card manufacturing to package labeling, as long as the equipment is added. Finally, there are some label packaging processes that can even be directly applied to the card-making process. For example: Shanghai Metro One-way Ticket (Thin Card), which is encapsulated into Inlay by the reverse sticking process and then delivered to the card factory for card manufacturing (only the thickness comparison Only thin, the production process is the same), printing.

The above-mentioned adopts the more advanced flip-chip and printed antenna technology. In fact, it uses the bonding production process, only the process of long bumps (long gold balls) is replaced, and the bonding process is used to replace the flip-chip process. The other is the same as the above. The use of corroded antennas is simpler, without the process of antenna printing.

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